Labels Milestones
BackPower Integration Y Package SIPAK, Horizontal, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-2 Horizontal RM 2.54mm TO-220F-3, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-1 TO-220-11, Vertical, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Vertical RM 2.54mm staggered type-1 TO-220-5, Horizontal, RM 2.54mm, see https://www.diodes.com/assets/Package-Files/TO126.pdf TO-126-3 Horizontal RM 2.54mm staggered type-1 TO-220-11, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 22.86mm 900mil SMDSocket SmallPads 4-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 10x-dip-switch SPST CTS_Series194-10MSTN, Piano, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 32-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 10-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 20-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 24-pin zero insertion force socket, though-hole, row spacing 15.24 mm (600 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 18-pin zero insertion force socket, through-hole, row spacing 11.48 mm (451 mils 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 4x-dip-switch SPST Copal_CVS-04xB, Slide, row spacing 7.62 mm (300 mils 6-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 6x-dip-switch SPST , Slide, row spacing 24.13 mm (950 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket 3M 28-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 10x-dip-switch SPST KingTek_DSHP10TJ, Slide, row spacing 25.4 mm (1000 mils), Socket 42-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x16.8mm (see e.g. Http://www.ti.com/lit/ds/symlink/drv5023.pdf TO-92L leads in-line (large body variant of 8-Lead Plastic Stretched Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SO, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, old mpn/engineering.
- TO-220-7 Horizontal RM 2.29mm IPAK TO-251-3, Horizontal.
- 0.881923 -0 vertex -2.00861 -6.18187 20 vertex 1.49905.