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From ec67859b1c2779470b99801ce69f8850b83fa3e1 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Initial version *.bck New KiCad version; non Al panel Gerbers ) ) ) Final revision; added custom DRC as project file (pts Final revision; added custom DRC as project file c4e1c30b9b Add jlc constraints DRC; replace order number text Compare 19 commits » merged pull request 'Put title box in PDF export' (#4) from schematic by Eeschema 5.1.10-88a1d61d58~88~ubuntu20.04.1 | Refs | Qty | Component | Description | Manufacturer | Part | Vendor | SKU | | | 14 pin connector, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F215079%7FY1%7Fpdf%7FEnglish%7FENG_CD_215079_Y1.pdf%7F215079-4 connector TE-Connectivity Micro-MaTch Vertical 1-215079-8 8-215079-18 TE-Connectivity Micro-MaTch Vertical 1-215079-2 8-215079-12 TE-Connectivity Micro-MaTch Vertical 2-215079-0 9-215079-20 TE-Connectivity Micro-MaTch Vertical 1-215079-4 8-215079-14 TE-Connectivity Micro-MaTch female-on-board top-entry thru-hole 6 pin 0.5mm Pitch http://www.st.com/resource/en/datasheet/ecmf02-2amx6.pdf UQFN DFN 0.5 ST 20-Lead Plastic Shrink Small Outline (SO) - Wide, 5.3 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Quad Flat, No Lead Package - 10x10x0.9 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Shrink Small Outline No-Lead http://www.ti.com/lit/ml/mpds176e/mpds176e.pdf Plastic Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SO, 8 Pin (https://www.nxp.com/docs/en/data-sheet/PCF8523.pdf (page 57)), generated with kicad-footprint-generator JST SH series connector, 502585-1170 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py mlf 8 2x2 mm 16-Lead Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [QFN]; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00213872.pdf WLCSP-64, 8x8 raster, 4.466x4.395mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303zd.pdf WLCSP-100, 10x10 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.61x2.88mm package, pitch 0.5mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f091vb.pdf WLCSP-64, 8x8 raster, 3.141x3.127mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 15.24 mm (600 mils), Socket 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 2x-dip-switch SPST , Slide, row spacing 7.62.

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