Labels Milestones
BackTSSOP10: plastic thin shrink small outline package; 56 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 56 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 24 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline package; 32 leads; body width 3.9 mm; lead pitch 0.635; (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220F-5 Vertical RM 1.7mm staggered type-2 TO-220-7 Horizontal RM 5.475mm SOT-93 TO-220-2, Horizontal, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 1.7mm PentawattF- MultiwattF-5 TO-220F-7, Vertical, RM.
- Bytes Images/loop.png | Bin 12821 -> 0.
- TO-263, D2 Pak, https://www.shopaavid.com/Product/573300D00000G Heatsink AAVID TO-263.
- 80 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf.
- 0.4P CASE 932BH (see ON Semiconductor 506CN.PDF.
- Finder 40.11 Relay DPDT Finder 40.51 Pitch 5mm.