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Grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area.

• 9.715134e+01 5.903821e+00 facet normal -0.0975473 -0.990438 0.0975565.
• (http://www.ti.com/lit/ds/sbos354a/sbos354a.pdf, JEDEC MO-220 variation VJJD-2), generated.
• 2.25mm soldermask opening Circular.
• 0.654318 0.705982 facet normal -0.665695 0.586529 0.46134 facet.
• 0.6x1mm 0.375mm height package, https://www.ti.com/lit/ml/mpss034c/mpss034c.pdf, https://www.ti.com/lit/ds/symlink/tpd6e05u06.pdf.

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