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Light-direction downwards, see http://www.kodenshi.co.jp/products/pdf/sensor/photointerrupter_ref/SG-105.pdf Laser Diode, TO18-like (D=5.6mm), 3pin Laser Diode, TO18-like (D=5.6mm), 3pin Laser Diode, TO18-like (D=5.6mm), 3pin Laser Diode, TO-56, 3pin lightpipe triple tower right angle right angle (http://www.molex.com/pdm_docs/sd/483930003_sd.pdf USB 3.0 3.1 3.2 4.0 Type-C receptable, through-hole mount, SMD, right-angle (https://www.molex.com/pdm_docs/sd/1054500101_sd.pdf USB C Type-C Receptacle SMD USB Micro-B receptacle, horizontal, SMD, 10118193, with flange, bottom-mount, SMD, right-angle (https://www.molex.com/pdm_docs/sd/1054500101_sd.pdf USB C Type-C Receptacle SMD USB 2.0 Type C Receptacle, GCT, 16P, top mounted, horizontal, 3A: https://gct.co/files/drawings/usb4135.pdf USB C Type-C Receptacle Hybrid CNCTech C-ARA1-AK51X USB Type C Plug Shenzhen Jing Tuo Jin Electronics Co 918-118A2021Y40002 ( https://datasheet.lcsc.com/lcsc/1912111437_Jing-Extension-of-the-Electronic-Co--918-118A2021Y40002_C399939.pdf ) also compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, QFM MOF0009A, 6x8x2mm (http://www.ti.com/lit/ml/mpsi063a/mpsi063a.pdf QFN, 41 Pin (http://www.ti.com/lit/ml/mpqf506/mpqf506.pdf QFN, 28 Pin (JEDEC MO-153 Var BC-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.vishay.com/docs/20056/crcw01005e3.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a single 1 mm² wires, reinforced insulation, conductor diameter 1.4mm, outer diameter 3mm, see , script-generated with , script-generated with , script-generated with , script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block WAGO 236-414 45Degree pitch 10mm size 25.8x8.2mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00294 pitch 5.08mm size 15.2x8.45mm^2 drill 1.1mm pad 2.1mm terminal block RND 205-00302 pitch 10mm Varistor, diameter 7mm, width 4.9mm, pitch 10mm Varistor, diameter 9mm, width 3.9mm, pitch 7.5mm Varistor, diameter 12mm, width 5.8mm, pitch 10mm size 35x8.1mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00292 pitch 5.08mm 4W length 18mm diameter 10mm Electrolytic Capacitor CP, Axial series, Axial, Horizontal, pin pitch=27.5mm, , length*diameter=22*9.5mm^2, http://cdn-reichelt.de/documents/datenblatt/B300/STYROFLEX.pdf C Axial series Axial Horizontal pin pitch 15.24*22.86mm^2 length 41.91mm width.

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