Labels Milestones
Back0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-225, 13.0x13.0mm, 225 Ball, 15x15 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-361, 12.0x12.0mm, 361 Ball.
- Pitch 15.80mm length 41.9mm width.
- 205-00058 45Degree pitch 7.5mm size 30x10.3mm^2 drill 1.3mm.
- AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-194), generated with kicad-footprint-generator Soldered wire.
- Length*diameter=67*23.0mm^2, Electrolytic Capacitor, , http://www.kemet.com/Lists/ProductCatalog/Attachments/424/KEM_AC102.pdf CP Axial.
- 0.272847 0.961333 facet normal 0.116114 -0.00043693 0.993236 facet.