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Pin (http://www.ti.com/lit/ds/symlink/msp430f5217.pdf#page=120), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 105310-xx10, 5 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP18: plastic shrink small outline package; 44 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 44 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 44 leads; body width 4.4 mm; thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 122BX.PDF 32-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_12_05-08-1723.pdf DFN, 12 Pin (https://ww2.minicircuits.com/case_style/DQ1225.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WDFN, 8 Pin (https://www.jedec.org/system/files/docs/mo-187F.pdf variant AA), generated with kicad-footprint-generator Mounting Hardware, inside through hole straight pin header, 1x04, 2.54mm pitch, double rows Through hole vertical IDC box header 2x03.

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