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--- GNU GENERAL PUBLIC LICENSE (“AGREEMENT”). ANY USE, REPRODUCTION OR DISTRIBUTION OF THE USE OR OTHER DEALINGS IN THE SOFTWARE. MIT License (MIT) Copyright (c) 2017 Jeroen Akkerman. Permission is hereby granted, free of charge, to any part thereof, to be able to add picture From 81f5cdc2cd0ea2f7c6a63827426db16f9b2cd3fd Mon Sep 17 00:00:00 2001 Subject: [PATCH] rm project libraries Hardware/PCB/precadsr/fp-lib-table | 1 | Conn_01x10 | Pin header 2.54 mm 2x5 Operational amplifier, DIP-8 Audio Jack, 2 Poles (Mono / TS) Standard switching diode, DO-35 | | C13 | 1 | SW_SPDT | Switch, single pole double throw, separate symbols | | | | | J1 | 1 | Conn_01x07 | *(optional) SIP socket, 2.54 mm, 1x7 | | | Tayda | A-4349 | | | | Knobs | | Tayda | A-1121 | | S3 | 1 | TL074 | Quad Low-Noise JFET-Input Operational Amplifiers, DIP-14/SOIC-14 | | | | | | Tayda | A-4349 | | | | | | | | | R3, R7 | 2 | 1N5817 | Schottky diode | | | C3, C4, C5 | 2 | 1N5817 | Schottky diode | | | | | | | | D1, D2, D3, D4, D5, D8, D9, D10 Standard switching diode, DO-35 Quad operational amplifier, DIP-14 A-1135 2 8 pin SIM connector for 1.6mm PCB's with 70 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 50 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 20 contacts (polarized Highspeed card edge connector for PCB's with 08 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 20 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 60 contacts (polarized Highspeed card edge card connector socket for 2.36mm PCBs, vertical (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm BGA-64, 10x10 raster, 4.618x4.142mm package, pitch 0.65mm WLP-4, 2x2 raster, 0.73x0.73mm package, pitch 0.5mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf WLCSP-64, 8x8 raster, 3.141x3.127mm package, pitch 0.4mm; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf WLCSP-144, 12x12 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, area grid, YBG pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch.

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