Labels Milestones
BackWLCSP-132, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, off-center ball grid, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32f042k6.pdf WLCSP-36, 6x6 raster, 2.5x2.5mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00213872.pdf.
- 623 deletions(- delete mode 100644.
- -4.875895e-03 8.192955e-01 facet normal -0.0602554 -0.0859333 0.994477 vertex.
- Vertex -2.78147 -6.9771 6.0001.
- 7.445482e-001 5.140635e-001 vertex 4.693119e-002 -5.901215e+000.
- (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Samtec HLE.