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Ipc_gullwing_generator.py TSSOP28: plastic thin shrink small outline package; 32 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 24 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic DFN (1.3mm x 1.2mm DFN, 8 Pin (http://www.ti.com/lit/ml/mpds400/mpds400.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 1 mm² wire, reinforced insulation, conductor diameter 1.25mm, outer diameter 2mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-110-02-xxx-DV-A, 10 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5569-10A1, example for new mpn: 39-28-x12x, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation CD), generated with kicad-footprint-generator Soldered wire connection, for 4 times 2.5 mm² wires, reinforced insulation, conductor diameter 1.4mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0170, 17 Circuits (http://www.molex.com/pdm_docs/sd/5022501791_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-100132.PDF), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0610, with PCB locator, 2 Pins per row.

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