Labels Milestones
BackFBV900 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Through hole socket strip SMD 1x17 1.00mm single row style2 pin1 right Through hole angled pin header SMD 1x35 1.27mm single row Through hole angled pin header SMD 1x21 1.00mm single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x07, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip THT 2x13 2.00mm double row Through hole angled pin header THT 1x32 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 2x02 2.00mm double row Through hole straight pin header, 1x26, 2.00mm pitch, 4.2mm pin length.
- -0.364903 0.547893 0.752767 facet normal 0.25505.
- -1.000000e+00 -4.968678e-07 vertex -1.043309e+02 9.665134e+01.