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ST WLCSP-20, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, RWH0032A, 8x8x0.9mm (http://www.ti.com/lit/ds/snosd10c/snosd10c.pdf.

• -0.61809 -0.683075 0.389067 vertex 5.79165 4.46475.
• -0.467997 -0.312516 -0.826627 vertex -2.92547 1.22714.
• + NFC module Modtronix Wireless.
• 2x39 1.00mm double row Through.

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