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22-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 12-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), SMDSocket, SmallPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 28-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row spacing 5.9 mm.

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