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Connector, B15B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator XP_POWER IAxxxxS SIP DCDC-Converter XP_POWER IHxxxxD, DIP, (https://www.xppower.com/pdfs/SF_IH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=295), generated with kicad-footprint-generator ipc_noLead_generator.py DFN8 2x2, 0.5P; CASE 505AB (see ON Semiconductor 122BX.PDF 32-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad LQFP, 32 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_32_05-08-1693.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 0.25 mm² wires, basic insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger.

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