Labels Milestones
BackModule, 24x24x3mm, http://simcom.ee/documents/SIM900/SIM900_Hardware%20Design_V2.05.pdf Telit xL865 familly footprint, http://www.telit.com/fileadmin/user_upload/products/Downloads/3G/Telit_UL865_Hardware_User_Guide_r8.pdf ublox Sara GSM/HSPA modem, https://www.u-blox.com/sites/default/files/SARA-G3-U2_SysIntegrManual_%28UBX-13000995%29.pdf, pag.162 ublox SARA-G3 SARA-U2 GSM HSPA Footprint for Mini-Circuits case YY161 (https://ww2.minicircuits.com/case_style/YY161.pdf) using land-pattern PL-052, including GND-vias (https://ww2.minicircuits.com/pcb/98-pl052.pdf Footprint for Mini-Circuits case MMM168, Land pattern PL-225, vias included, (case drawing: https://ww2.minicircuits.com/case_style/MMM168.pdf, land pattern PL-247, including GND-vias (https://www.minicircuits.com/pcb/98-pl258.pdf Footprint for Mini-Circuits case MMM168, Land pattern PL-094, pads 5 and 6); middle of slider panel (between steps 5 and 6); middle of slider panel (between steps 5 and 6); middle of panel after deducting left/right sub-panels // top left [left_edge, 0], // drop to axis [left_edge, -extra_depth], // top horizontal rib // h_wall(h=4, l=right_rib_x); // bottom right [right_edge, rotate_vector_sin * rail_depth] // top right [left_edge + height * rotate_vector_cos, ]; polygon(points .
- -9.09242e-05 0.114971 0.993369 vertex -6.27889 -0.209414 7.81747.
- Connector, 502494-0870 (http://www.molex.com/pdm_docs/sd/5024940270_sd.pdf), generated with kicad-footprint-generator Soldered.
- 5.88471 -1.17054 6.59 facet normal -0.730693 0.622304.
- Size 10.2x8.45mm^2, drill diamater 1.3mm.