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ST WLCSP-20, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.5mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch.

• -5.11681 7.04537 vertex 4.40436 5.23815.
• -1.51183e-05 facet normal -8.314602e-01 -5.555843e-01.
• 7.669265e-001 0.000000e+000 facet normal -0.779905 0.400414.

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