Labels Milestones
Back1 FT256 FTG256 Spartan-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments EUS 5 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant AB), generated with StandardBox.py) (https://product.tdk.com/info/en/document/catalog/smd/inductor_commercial_power_slf7055_en.pdf Inductor, TDK, MLZ2012_h0.85mm, 2.0x1.25x0.85mm, "https://product.tdk.com/system/files/dam/doc/product/inductor/inductor/smd/catalog/inductor_commercial_decoupling_mlz2012_en.pdf" Inductor, TDK, SLF12575, 12.5mmx12.5mm (Script generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-141-02-xxx-DV-LC, 41 Pins per row (http://www.molex.com/pdm_docs/sd/431600105_sd.pdf), generated with kicad-footprint-generator Harwin Female Vertical Surface Mount Tactile Switch SPST Slide 7.62mm 300mil SMDSocket SmallPads 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 32-lead dip package, row spacing 15.24 mm (600 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 28-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils 14-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 8-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm SMD DIP Switch SPST Slide 7.62mm 300mil LongPads 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 8x-dip-switch SPST Copal_CVS-08xB, Slide, row spacing 10.16 mm (400 mils 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 4-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 4x-dip-switch SPST Copal_CVS-04xB, Slide.
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