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Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP, 16 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=266), generated with kicad-footprint-generator JST PUD series connector, SM17B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator.

• -0.0703598 facet normal 0.99518.
• Header, 1x39, 2.00mm pitch, double rows Surface mounted.
• -0.598712 0.632551 facet normal -0.264278.
• -0.995184 0.0980262 9.21874e-06 facet normal.

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