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BackAtmel Appnote 8826 64-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body, 2.00 mm Footprint [HTQFP] thermal pad HTSSOP32: plastic thin shrink small outline package; 16 leads; body width 4.4 mm (see NXP sot054_po.pdf TO-92 2-pin leads in-line, wide, drill 0.75mm (see NXP sot054_po.pdf TO-92 2-pin variant by Heraeus, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN, 4mm x 3mm.
- Coilcraft, XAL7030-161, 8.0x8.0x3.1mm, https://www.coilcraft.com/getmedia/0d05a05e-d55d-4a0c-911d-46bd73686633/xal7030.pdf Inductor, Coilcraft.
- (http://www.allegromicro.com/en/Products/Current-Sensor-ICs/Fifty-To-Two-Hundred-Amp-Integrated-Conductor-Sensor-ICs/ACS758.aspx Allegro Microsystems SIP-3, 1.27mm Pitch.
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- -7.01491 -0.282485 6.94563 vertex -5.14541 -4.97595 6.88072.