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46007-1103, With thermal vias in pads, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://www.ti.com/lit/ds/symlink/tpd4e02b04.pdf USON-10 2.5x1.0mm Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm http://www.ti.com/lit/ds/symlink/txb0108.pdf USON-20 2x4mm Pitch 0.4mm http://www.ti.com/lit/ds/symlink/txb0108.pdf USON-20 2x4mm Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm X2SON-8 1.4x1mm Pitch0.35mm http://www.ti.com/lit/ds/symlink/pca9306.pdf Maxim Integrated TSOC-6 D6+1,https://datasheets.maximintegrated.com/en/ds/DS2401.pdf, https://pdfserv.maximintegrated.com/land_patterns/90-0321.PDF ATPAK SMD package, http://www.ti.com/lit/ds/symlink/lm4755.pdf D2PAK DDPAK TO-263 D2PAK-7 TO-263-7 SOT-427 TO-263 / D2PAK / DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-5-1/ D2PAK DDPAK TO-263 D2PAK-3 TO-263-3 SOT-404 diode TO-263 / D2PAK / DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-5-1/ TO-263/D2PAK/DDPAK SMD package, orientation marker.

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