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HLE-134-02-xxx-DV-BE-A, 34 Pins (http://www.molex.com/pdm_docs/sd/5024301410_sd.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, B15B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, AFC07-S06FCA-00, 6 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000994748), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-05P-1.25DS, 5 Pins per row, Mounting: PCB Mounting Flange (http://www.molex.com/pdm_docs/sd/039291047_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LGA, 14 Pin (https://www.st.com/resource/en/datasheet/l6491.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 8-Lead Plastic Stretched Small Outline Narrow Body (QR)-.150" Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package, 1.2x1.8x1.55 mm Body (http://www.ti.com/lit/ml/msop002a/msop002a.pdf SOIC, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4001f.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 55560-0241, 24 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole ST Morpho Connector 144 With STLink ST Morpho Connector 144 STLink AI accelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments EUS 5 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), Socket, LongPads 32-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x9.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 4x-dip-switch SPST Omron_A6H-4101, Slide, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 24.13 mm (950 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 2x-dip-switch SPST , Slide, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil Socket 64-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL ZIF 10.16mm 400mil SMDSocket SmallPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 10x-dip-switch SPST KingTek_DSHP10TJ, Slide, row spacing 7.62 mm (300 mils 22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 14-lead.

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