Labels Milestones
Back1x28, 1.27mm pitch, double rows Surface mounted socket strip SMD 1x06 1.27mm single row Through hole straight Samtec HPM power header series 3.81mm post length THT 1x16 2.54mm single row Through hole socket strip SMD 1x24 1.00mm single row Surface mounted pin header THT 2x01 2.54mm double row Through hole horizontal IDC box header THT 2x17 2.54mm double row Through hole angled socket strip THT 2x07 2.54mm double row Through hole straight pin header, 1x25, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x12, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip THT 1x39 1.27mm single row Surface mounted pin header THT 2x13 2.00mm double row Through hole straight socket strip, 2x20, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight pin header, 2x39, 2.54mm pitch, 8.51mm socket length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled socket strip, 2x15, 2.00mm pitch, 6.35mm socket length, double rows Through hole IDC header, 2x20, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x27, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, NSMD, YZP0005 pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 14x14 grid, 8x8mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f091vb.pdf WLCSP-64, 8x8 raster, 3.141x3.127mm package, pitch.
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