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Micro Small Outline (SS)-5.30 mm Body [HTSSOP], with thermal vias in pads, 3 Pins per row (http://www.molex.com/pdm_docs/sd/1053101208_sd.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 09-65-2028, 2 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with.

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