Labels Milestones
BackTDSON-8-1, 5.15x5.9mm (https://www.infineon.com/cms/en/product/packages/PG-TDSON/PG-TDSON-8-1/ TO-50-3 Macro T Package Style M236 TO-50-4 Macro X Package Style M238 TO-252 / DPAK SMD package, http://www.onsemi.com/pub/Collateral/ENA2192-D.PDF Analog Devices KS-4, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sc70ks/ks_4.pdf Analog Devices KS-4, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sc70ks/ks_4.pdf Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf WSON 8 1EP ThermalVias WSON, 8 Pin (http://www.ti.com/lit/ds/symlink/lp2951.pdf#page=27), generated with kicad-footprint-generator Molex Molex 0.30mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0180, 18 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2021, 2 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator.
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