Labels Milestones
BackBump 2x4 (perimeter) array, NSMD pad definition Appendix A BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole angled pin header SMD 1x34 1.27mm single row (from Kicad 4.0.7), script generated Through hole IDC header, 2x12, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x34, 1.27mm pitch.
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