Labels Milestones
Back1 FG484 FGG484 Artix-7 BGA, 19x19 grid, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole horizontal IDC box header.
- Vertex 8.40938 -5.61897 2.58057 vertex -5.61897 8.40938 2.58057.
- 9.798962e-01 vertex -1.079020e+02 9.725134e+01 8.909213e+00.
- HLE-146-02-xxx-DV-LC, 46 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29.
- -0.840148 0.533173 0.0993848 vertex -7.01045 -3.85403 20 facet.
- 0.0600186 0.98763 vertex 4.1763 0.113982 18.7299.