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Package; 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, Analog Devices (Linear Tech), 133-pin LGA uModule, 15.0x15.0x4.32mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf NXP LGA, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20005474E.pdf#page=25), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm.

Normal -4.720702e-001 8.093056e-001 3.495342e-001 vertex 2.057825e+000 -3.532552e+000.
0.111552 0.923216 vertex 6.36396.
78171-0005 (http://www.molex.com/pdm_docs/sd/781710002_sd.pdf), generated with.
9.685420e-001 0.000000e+000 facet normal -0.00736135 0.0989405 0.995066 vertex.

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