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Pitch, S-PVSON-N8, http://www.ti.com/lit/ds/symlink/opa2333.pdf 3x3mm Body, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stulpi01a.pdf TFBGA-64, 8x8 raster, 4.539x4.911mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00213872.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7b3ri.pdf ST TFBGA-257, 10.0x10.0mm, 257 Ball.

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