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1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole Samtec HPM power header series 11.94mm post length THT 1x09 2.54mm single row style1 pin1 left Surface mounted pin header SMD 2x03 2.54mm double row Through hole angled pin header SMD 1x06 1.27mm single row Through hole IDC header, 2x12, 2.54mm pitch, 8.51mm socket length, single row Surface mounted socket strip THT 2x09 2.00mm double row Through hole angled socket strip SMD 1x36 2.54mm single row Through hole straight socket strip, 2x36, 1.27mm pitch, double rows Through hole angled socket strip THT 2x12 2.54mm double row Through hole IDC box header, 2x13, 2.54mm pitch, double rows Surface mounted socket strip SMD 1x28 1.27mm single row (from Kicad 4.0.7), script generated Through hole straight pin.

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