3
1
Back

Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 10 leads; body width 4.4 mm; thermal pad TSSOP HTSSOP 0.65 thermal pad TSSOP HTSSOP 0.65 thermal pad with vias HTSSOP.

New Pull Request