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SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 80, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator JST ZE series connector, B14B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator JST GH series connector, 53398-0571 (http://www.molex.com/pdm_docs/sd/533980271_sd.pdf), generated with kicad-footprint-generator JST XA series connector, S10B-XH-A-1 (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py package for Vishay CNY70 refective photo coupler/interrupter Vishay CNY70 refective photo coupler package for diode bridges, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 10.16mm 400mil LongPads 5-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 10x-dip-switch SPST KingTek_DSHP10TS, Slide, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 8x-dip-switch SPST Copal_CHS-08B, Slide, row spacing 15.24 mm (600 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x22.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 4x-dip-switch SPST Copal_CHS-04B, Slide, row spacing 7.62 mm (300 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 11x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils), Clearance8mm 8-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD DIP DIL ZIF 25.4mm 1000mil SMDSocket SmallPads 22-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic Micro Small Outline (SS)-5.30 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf DFN package size 0604 3 pins IR-LED, diameter 3.0mm, 2 pins, diameter 5.0mm z-position of LED center 1.0mm, 2 pins, pitch 2.5mm, size 10.5x5mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00056_DB_EN.pdf, script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block WAGO 804-309 45Degree pitch 7.5mm size 22.5x9mm^2 drill 1.3mm pad 2.5mm terminal block.

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