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(j4/j10) // clock in (j2/j11 // casc out (j14/j15 // reset/casc in (j1/j13 // gate out (j4/j10) // clock out (j5/j12) // glide in (j16/j17 // cv out (j7/j6) // pause (j18/j19 // 10 steps based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera BGA-153 M153 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 7.62 mm (300 mils), Socket 14-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 7x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 9x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET MF MOSFET Infineon DirectFET SC MOSFET Infineon DirectFET MC MOSFET Infineon DirectFET MF MOSFET Infineon DirectFET MC MOSFET Infineon DirectFET SJ MOSFET Infineon DirectFET M2 MOSFET Infineon DirectFET MB MOSFET Infineon DirectFET S1 MOSFET Infineon DirectFET SH MOSFET Infineon DirectFET MC MOSFET Infineon PLCC, 20 pins, through hole 2.7mm, height 9, Wuerth electronics 9771050360 (https://katalog.we-online.com/em/datasheet/9771050360.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41791-0018 example for new mpn: 39-30-0100, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5566-04A, example for new mpn: 39-28-x16x, 8 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 0.1 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py 16-Lead Ultra Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506AF.PDF DKD Package; 32-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [QFN] with thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Thin Shrink Small Outline (SN) - Narrow, 3.90 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf VSON, 10 Pin (https://fscdn.rohm.com/en/techdata_basic/ic/package/Jisso_MLGA010V020A-1-2_Rev005s_E2(MSL3).pdf ST HLGA, 10 Pin (https://www.st.com/resource/en/datasheet/lps25hb.pdf#page=46), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 48 Pin (https://static.dev.sifive.com/SiFive-FE310-G000-datasheet-v1p5.pdf#page=20), generated with kicad-footprint-generator Mounting Hardware, external M3, height 7, Wuerth electronics.

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