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6.73mm 264mil SMD LowProfile JPin SMD 10x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils), Socket, LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x30.12mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 3x-dip-switch SPST Omron_A6S-310x, Slide, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 5-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 22-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 6x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 14-lead surface-mounted (SMD) DIP package, row spacing 6.15 mm (242 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 5x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 48-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 18-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 9.78x32.66mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 8x-dip-switch SPST KingTek_DSHP08TS, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic DFN (3mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF 14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package; 16-Lead Plastic DFN (3mm x 2mm) 0.40mm pitch DDB Package; 8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad Variation; (see NXP sot054_po.pdf TO-92 leads in-line, narrow, oval pads, drill 0.75mm (http://www.produktinfo.conrad.com/datenblaetter/175000-199999/181293-da-01-de-TO92_Temperatursensor_PT1000_32209225.pdf Molded Japan Transistor Package 7x4x9mm^3, http://rtellason.com/transdata/2sb734.pdf Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220F-4, Vertical, RM 1.7mm, MultiwattF-11, staggered type-2, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 2.54mm staggered type-1 TO-220-11, Horizontal, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-1, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Horizontal RM 1.7mm MultiwattF-11 staggered type-2 TO-220F-5 Vertical RM 2.54mm TO-220-3, Vertical, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-2 Horizontal RM 1.7mm Pentawatt Multiwatt-5 staggered type-1 TO-220-4 Vertical RM 1.7mm.

DIP-8/SOIC-8/TO-99-8"/>

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