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EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf sensor pressure ssop 98ARH99066A sensor pressure ssop 98ARH99089A pressure sensor with stainless steel cap Egg with 42x60mm Body-Size, ClassA, according to land-pattern PL-005, including GND vias (https://www.minicircuits.com/pcb/98-pl176.pdf Footprint for Mini-Circuits case YY161 (https://ww2.minicircuits.com/case_style/YY161.pdf Footprint for Mini-Circuits case CD542 (https://ww2.minicircuits.com/case_style/CD542.pdf) using land-pattern PL-052, including GND-vias (https://ww2.minicircuits.com/pcb/98-pl052.pdf Footprint for Mini-Circuits case TTT167 (Mini-Circuits_TTT167_LandPatternPL-079) following land pattern PL-012, including GND vias (https://www.minicircuits.com/pcb/98-pl176.pdf Footprint for Mini-Circuits cas HZ1198 (https://ww2.minicircuits.com/case_style/HZ1198.pdf) following land pattern PL-247, including GND-vias (https://ww2.minicircuits.com/pcb/98-pl052.pdf Footprint for Mini-Circuits case MMM168 (https://ww2.minicircuits.com/case_style/MMM168.pdf Footprint for Mini-Circuits case CK605 (https://ww2.minicircuits.com/case_style/CK605.pdf Footprint for Mini-Circuits case CK605 (https://ww2.minicircuits.com/case_style/CK605.pdf Footprint for Mini-Circuits case YY161 (https://ww2.minicircuits.com/case_style/YY161.pdf Footprint for Mini-Circuits cas.

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