Labels Milestones
Back3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 24 leads; body width 16.90 mm Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x21.88mm.
- MPT-0,5-3-2.54 pitch 2.54mm DCDC-Converter, RECOM, RECOM_R-78B-2.0, SIP-3, pitch.
- Piezo buzzer self drive oscillator magnetic transducer buzzer.
- (http://www.molex.com/pdm_docs/sd/5022441530_sd.pdf molex FFC/FPC connector.
- AGPL-1.0 Copyright (c) 2014, David Kitchen All rights.