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BackHttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Surface mounted pin header SMD 2x31 2.54mm double row Through hole IDC header, 2x17, 2.54mm pitch, single row Through hole angled socket strip, 1x36, 1.00mm pitch, single row Through hole straight pin header, 2x14, 2.54mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight socket strip, 1x02, 2.54mm pitch, single row Through hole angled socket strip, 1x14, 2.00mm pitch, double rows Through hole angled.
- For: MCV_1,5/8-GF-3.81; number of pins: 07; pin pitch.
- Coilcraft, XAL7030-562, 8.0x8.0x3.1mm, https://www.coilcraft.com/getmedia/0d05a05e-d55d-4a0c-911d-46bd73686633/xal7030.pdf Inductor, Coilcraft, XAL7020-122, 8.0x8.0x2.0mm.