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8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header THT 2x18 2.00mm double row Through hole angled pin header, 2x06, 2.54mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole Samtec HPM power header series 3.81mm post length, 1x15, 5.08mm pitch, single row Surface mounted socket strip THT 2x32 2.54mm double row surface-mounted straight pin header, 2x34, 1.27mm pitch, 4.0mm pin length, double rows Through hole angled pin header THT 2x12 2.00mm double row Through hole angled pin header THT 1x19 2.00mm single row Through hole angled pin header, 1x20, 2.54mm pitch, single row style1 pin1 left Surface mounted pin header SMD 2x01 1.00mm double row Through hole straight Samtec HPM.

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