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Http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf LFCSP VQ, 48 pin, exposed pad: 4.5x8.1mm, with thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic SO, Exposed Die Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf SSOP 0.50 exposed pad 8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 16 12 Wide 16-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL ZIF 7.62mm 300mil LowProfile 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 32-lead dip package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 3x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 5x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 8-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm.

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