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BackCopper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes unplated through holes: ============================================================= From a22bca6d29ddc0a54597dab4d11ad9ab7e48e3c6 Mon Sep 17 00:00:00 2001 Subject: [PATCH 05/13] move bugs to md file to be able to add picture Schematics/{schematic_bugs_v1.txt => schematic_bugs_v1.md} | 3 | 10uF | Electrolytic capacitor | | | J11 | 1 | 2_pin_Molex_header | KK254 Molex connector 2.54 mm spacing Pin header 2.54 mm spacing"/>