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1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline (SS)-5.30 mm Body [HTSSOP], with thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf LFCSP, 16 Pin (https://www.st.com/resource/en/datasheet/stspin220.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-148 , 18 Pins (http://www.molex.com/pdm_docs/sd/903250004_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.25.

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