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FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator connector Molex Mini-Fit_Jr top entryplastic_peg Molex Mini-Fit Jr. Power Connectors, 105309-xx02, 2 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Harting har-flexicon series connector, 505405-0470 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator Connector Phoenix Contact, SPT 1.5/4-H-3.5 Terminal Block, 1732454 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1732454), generated with kicad-footprint-generator Hirose DF11 vertical Hirose DF11 through hole, DF13-11P-1.25DS, 11 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0300, 30 Circuits (https://www.molex.com/pdm_docs/sd/2005280300_sd.pdf), generated with kicad-footprint-generator Diode SMD diode bridge SMD diode bridge Three phase, Bridge, Rectifier, https://www.comchiptech.com/admin/files/product/SC35VB80S-G%20Thru506369.%20SC35VB160S-G%20RevB.pdf 4-lead dip package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 18-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket, LongPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD DIP DIL PDIP 2.54mm 22.86mm 900mil SMDSocket SmallPads 22-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 10.8x29.5mm 11x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 15.24mm 600mil Socket 3M 24-pin zero insertion force socket, through-hole, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 package, like 6-lead dip package for diode bridges, row spacing 9.53 mm (375 mils), Clearance8mm 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf THT DIP DIL PDIP.

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