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S12B-XH-A-1 (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0430, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Connector Phoenix Contact SPT 2.5/2-H-5.0 Terminal Block, 1991011 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1991011), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0410, with PCB locator, 12 Pins per row (http://www.molex.com/pdm_docs/sd/1053131208_sd.pdf), generated with kicad-footprint-generator JST ZE series connector, 14110713010xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13010XXX_100228421DRW063C.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP, 14 Pin (https://www.st.com/resource/en/datasheet/l6491.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DDB Package; 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf SSO Stretched SO SOIC Pitch 1.27 SSOP-8 2.9 x2.8mm Pitch 0.65mm SSOP-8 2.95x2.8mm Pitch 0.65mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0x15.9mm Pitch 1.27mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0x15.9mm Pitch 1.27mm 50ohms AXICOM HF3-Series Relay Pitch 1.27mm Slug Up (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0 x 15.9mm Pitch 0.65mm Slug Down (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP, 32 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T1655-4)), generated with kicad-footprint-generator JST XH series connector, S28B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: A-41792-0018 example for new part number: 09-65-2078, 7 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32 Pin (JEDEC MS-013AF, https://www.analog.com/media/en/package-pcb-resources/package/54614177245586rw_14.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-147-02-xxx-DV-LC, 47 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 7, Wuerth electronics 9771120360 (https://katalog.we-online.com/em/datasheet/9771120360.pdf), generated with kicad-footprint-generator JST PH series connector, 53780-0470 (), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-18S-0.5SH, 18 Pins (https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=826576&DocType=Customer+Drawing&DocLang=English), generated with kicad-footprint-generator Soldered wire connection, for 5 times 0.1 mm² wires, basic insulation, conductor diameter 1.4mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_310861_RT034xxHBLC_OFF-026114K.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block WAGO.

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