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FHG1761 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, VQFN-HR RNN0018A (http://www.ti.com/lit/ds/symlink/tps568215.pdf QFN, 16 Pin (JEDEC MO-153 Var BC-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-127-02-xxx-DV-BE-LC, 27 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 0.5 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter 2mm, see http://www.produktinfo.conrad.com/datenblaetter/550000-574999/556444-da-01-de-LEITERPLATTENKL__PTSM_0_5__4_2_5_V_THR.pdf, script-generated with , script-generated with , script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block Metz Connect Type059_RT06303HBWC pitch 3.5mm size 18.5x8.3mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00295 pitch 5.08mm 0.5W = 1/2W, length*width=8.38*2.54mm^2, http://www.vishay.com/docs/60051/cns020.pdf Resistor Box series Radial pin pitch 5.0mm, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/b40r.pdf diode bridge Thermal enhanced ultra thin fine pitch quad flat package (http://www.st.com/resource/en/datasheet/stm8s003f3.pdf ST UQFN 6 pin 0.5mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS711-Datasheet.ashx Allegro Microsystems 24-Lead Plastic QFN (4mm x 4mm) (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 122BX.PDF 32-Lead Plastic Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x38, 2.00mm pitch, 4.2mm pin length, double rows Through hole socket strip THT 2x01 1.27mm double row Through hole straight pin header, 2x07, 2.54mm pitch, double rows Through hole straight pin header, 1x26, 1.00mm pitch, single row Surface mounted socket strip THT 2x17 2.54mm double row Through hole angled pin header THT 1x32 1.27mm single row Surface mounted socket strip THT 1x14 2.54mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole straight pin header, 1x19, 1.27mm pitch, single row Through hole socket strip SMD 1x35 2.54mm single row Surface mounted pin header THT 1x13 1.00mm single row style2 pin1 right Through hole IDC box header 2x12 2.54mm double row Through hole socket strip SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip, labeled with numbers SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, pads 1-2 Bridged2Bar with 2 copper strips net tie solder jumper bridged SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, pads 1-2 Bridged2Bar with 2 pads, pad diameter 2.6mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_311751_RT027xxHBLC_OFF-022814U.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00298, 2 pins, pitch 5mm, size 50x9mm^2, drill diamater 1.15mm, pad diameter 2.4mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.5 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 3.9mm.

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