Labels Milestones
BackBoss (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Harwin Female Vertical Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 6x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 3x-dip-switch SPST KingTek_DSHP03TJ, Slide, row spacing 25.4 mm (1000 mils), Socket 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 6-lead surface-mounted (SMD) DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-1 TO-220F-7 Vertical RM 2.54mm TO-220-4 Vertical RM 2.286mm SIPAK, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-2 TO-220-7 Horizontal RM 1.27mm Multiwatt-7 staggered type-1 TO-220-9 Vertical 2.54mm Pitch (http://www.st.com/resource/en/datasheet/tda7264.pdf TO-220-9 Vertical RM 1.27mm MultiwattF-15 staggered type-2 TO-220F-9 Vertical.
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