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22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias in pads, 6 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13C-10P-1.25V%2851%29/), generated with kicad-footprint-generator Mounting Hardware, inside through hole straight socket strip, 2x24, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole angled socket strip SMD 1x28 1.27mm single row style2 pin1 right Through hole angled socket strip THT 1x34 1.27mm single row Through hole straight socket strip, 2x12, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight socket strip, 1x10, 2.00mm pitch, single row Through hole angled pin header, 1x10.

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