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0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (ST)-4.4 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 SSO, 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 42-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 25.24mm 993mil 42-lead surface-mounted (SMD) DIP package, row spacing 6.15 mm (242 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 6x-dip-switch SPST , Slide, row spacing 8.9 mm (350 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 6x-dip-switch SPST , Slide, row spacing 5.08 mm (200 mils), body size 10.8x4.1mm DIP Switch SPST Slide 5.08mm 200mil SMD JPin SMD 8x-dip-switch SPST Omron_A6H-8101, Slide, row spacing 8.89 mm (350 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 2x-dip-switch SPST , Slide, row spacing 22.86 mm (900 mils), https://wiki.wemos.cc/products:d1:d1_mini, https://c1.staticflickr.com/1/734/31400410271_f278b087db_z.jpg DIN rail adapter universal three M3 clearance holes Mounting Hole 5mm, no annular m2.5 iso7380 Mounting Hole 5mm, no annular mounting hole 4.3mm no annular m6 iso14580 Mounting Hole 6.5mm, no annular m6 din965 Mounting Hole 2.7mm, M2.5, DIN965 mounting hole 2.2mm no annular m4 iso14580 Mounting Hole 2.7mm, M2.5, ISO14580 mounting hole 4mm no annular m2 din965 Mounting Hole 4.3mm, no annular, M4 mounting screws (https://www.vishay.com/docs/95423/sot227g2.pdf, https://www.vishay.com/docs/95793/vs-fc420sa10.pdf TR TO-3 TO3 TO-204 TO-3P-3, Horizontal, RM 5.45mm, , see http://www.onsemi.com/pub/Collateral/340AC.PDF TO-3PB-3 Vertical RM 2.29mm IPAK TO-262-3, Horizontal, RM 2.54mm staggered type-1 TO-220-11, Horizontal, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 1.7mm Pentawatt Multiwatt-5 staggered type-1 TO-220-4 Vertical RM 1.27mm staggered type-1 TO-220F-2, Horizontal, RM 5.08mm, see https://www.centralsemi.com/PDFS/CASE/TO-220-2PD.PDF TO-220-2 Horizontal RM 1.7mm Pentawatt Multiwatt-5 staggered type-1 TO-220-4 Vertical RM 2.29mm IPAK TO-262-3, Horizontal, RM 2.286mm SIPAK Horizontal RM 5.08mm TO-126-2, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-1, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Vertical RM 2.54mm TO-251-2, Horizontal, RM 5.08mm, see http://cdn-reichelt.de/documents/datenblatt/A400/W005M-W10M_SEP.PDF diode bridge DFS, see http://www.vishay.com/docs/88854/padlayouts.pdf TO-269AA MBS diode bridge SMD diode bridge package, diameter 9.8mm, pin pitch 5.08mm size 45.7x11.2mm^2 drill 1.3mm.

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