Labels Milestones
BackJunior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 15x15 grid, 13x13mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-100, 10x10, 9x9mm package, pitch 0.8mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f100v8.pdf TFBGA-100, 10x10 raster, 4.201x4.663mm.
- (https://ams.com/documents/20143/36005/AS1115_DS000206_1-00.pdf), generated with kicad-footprint-generator.
- Power DIN 3-pin nonstandard DIN connector, shielded, PD-30S.
- (https://katalog.we-online.de/em/datasheet/9774080943.pdf), generated with kicad-footprint-generator.
- 74x15mm^2 drill 1.2mm pad 3mm.