Labels Milestones
BackVias and counter-pad, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm, thermal vias in pads, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator.
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- -2.539052e-03 9.887718e-01 facet normal 0.573948 0.598005 0.559441 facet.
- 1.519548e-001 9.883875e-001 0.000000e+000 facet.
- 0.773006 4.46254e-06 facet normal -0.225392 0.184976 0.956547 vertex.
- -0.0348208 0.996914 0.0703598 vertex 4.16572 -10.6141 0.18985 facet.