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2x2x0.9 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 32-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [HTQFP] thermal pad TQFP64.

• 8.39715 1.6703 5.56266 facet normal.
• 21 top-side contacts, 1.0mm pitch.

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