Labels Milestones
BackWLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 1924 1.
- MSTBVA_2,5/16-G-5,08; number of pins: 09; pin.
- 8.586316e-001 1.091305e-001 vertex 3.461637e+000 -2.679382e+000.
- 9360e76802ac5995a7ed0e953615a740e80016d7 Mon Sep 17 00:00:00 2001.
- 7.5mm width 2.5mm Capacitor C, Rect series, Radial.
- (http://www.ti.com/lit/ml/mpds382b/mpds382b.pdf), generated with kicad-footprint-generator Molex LY 20 series.